Produktbild: Wafer Bonding

Wafer Bonding

Lieferzeit: Lieferbar innerhalb 14 Tagen

374,49 €

inkl. 7 % MwSt. zzgl. Versandkosten

Applications and Technology, Springer Series in Materials Science 75

ISBN: 3540210490
ISBN 13: 9783540210498
Herausgeber: Marin Alexe/Ulrich Gösele
Verlag: Springer Verlag GmbH
Umfang: xv, 504 S., 363 s/w Illustr., 20 farbige Illustr., 504 p. 383 illus., 20 illus. in color.
Erscheinungsdatum: 14.05.2004
Auflage: 1/2004
Produktform: Gebunden/Hardback
Einband: Gebunden

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Artikelnummer: 5023725 Kategorie:

Beschreibung

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

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