Thermal contact resistance across different metallic composite pair

Lieferzeit: Lieferbar innerhalb 14 Tagen

35,90 

ISBN: 3659742058
ISBN 13: 9783659742057
Autor: Vyas, Bipin/Parmar, Nirmal/Jani, Deepak
Verlag: LAP LAMBERT Academic Publishing
Umfang: 76 S.
Erscheinungsdatum: 04.02.2017
Auflage: 1/2017
Format: 0.6 x 22 x 15
Gewicht: 131 g
Produktform: Kartoniert
Einband: Kartoniert
Artikelnummer: 2004801 Kategorie:

Beschreibung

Heat transfer describe the exchange of thermal energy, between physical systems depending on pressure & temperature, by dissipating heat. Heat transfer across a contact intermediate formed by any two solid systems is usually accompanied by a measurable temperature drop because there exists a thermal resistance to heat flow in the region of the intermediate. Thermal contact resistance (TCR) or resistance is of interest in many engineering fields i.e. satellite, internal combustion engineering, space craft, microelectronics, bearing with lubrication, mechanical applications, heat transfer across granular solids, superconductors, aerospace structures etc. The Practical study of heat transfer through surface contact resistance is very essential for advancement of thermal applications. It is required to understand the heat transfer between composite pair having same as well as different interface material. The outcomes will very essential for design of different heat transfer thermal applications. The sole objective of the dissertation work is to reduce the Thermal Contact Resistance (TCR) and increases thermal efficiency of the application.

Autorenporträt

Bipin Vyas presently serve as Research Fellow at Sardar Patel Renewable Energy Research Institute, India. He received the B.E. degree in Mechanical Engineering from The Maharaja Sayajirao University (M.S.U.), India and Master of Engineering in Mechanical with specialization in Energy Engineering in Gujarat Technological University, India.

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