Produktbild: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Lieferzeit: Lieferbar innerhalb 14 Tagen

192,59 €

inkl. 7 % MwSt. zzgl. Versandkosten

Materials, Processes, Equipment, and Reliability

ISBN: 3319992554
ISBN 13: 9783319992556
Herausgeber: Kim S Siow
Verlag: Springer Verlag GmbH
Umfang: xx, 279 S., 53 s/w Illustr., 122 farbige Illustr., 279 p. 175 illus., 122 illus. in color.
Erscheinungsdatum: 07.02.2019
Auflage: 1/2020
Produktform: Gebunden/Hardback
Einband: Gebunden

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. – Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have handson experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Artikelnummer: 5335772 Kategorie:

Beschreibung

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

Das könnte Ihnen auch gefallen …