Interfacial Compatibility in Microelectronics

Lieferzeit: Lieferbar innerhalb 14 Tagen

160,49 

Moving Away from the Trial and Error Approach, Microsystems

ISBN: 1447124693
ISBN 13: 9781447124696
Verlag: Springer Verlag GmbH
Umfang: x, 218 S., 113 s/w Illustr., 15 farbige Illustr.
Erscheinungsdatum: 13.01.2012
Weitere Autoren: Laurila, Tomi/Vuorinen, Vesa/Paulasto-Kröckel, Mervi et al
Auflage: 1/2012
Produktform: Gebunden/Hardback
Einband: Gebunden
Artikelnummer: 1333923 Kategorie:

Beschreibung

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the traditional method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

Das könnte Ihnen auch gefallen …