Produktbild: Packaging of High Power Semiconductor Lasers

Packaging of High Power Semiconductor Lasers

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181,89 €

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Micro- and Opto-Electronic Materials, Structures, and Systems

ISBN: 149395590X
ISBN 13: 9781493955909
Verlag: Springer Verlag GmbH
Umfang: xv, 402 S., 111 s/w Illustr., 386 farbige Illustr., 402 p. 497 illus., 386 illus. in color.
Erscheinungsdatum: 01.10.2016
Weitere Autoren: Liu, Xingsheng/Zhao, Wei/Xiong, Lingling et al
Auflage: 1/2015
Produktform: Kartoniert
Einband: Kartoniert

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

Artikelnummer: 9882543 Kategorie:

Beschreibung

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Autorenporträt

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

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