Beschreibung
This book explores a new idea of self-healing in the adhesive joint by introducing self-healing microcapsules in the epoxy resin based adhesive. About 90% of healing efficiency can be achieved due to the incorporation of those self-healing microcapsules. The microcapsules containing healing agent were synthesized using in-situ solvent evaporation technique. Whenever crack propagates through the matrix, the capsule releases healing agent in the crack path, polymerization occurs thereby heal the crack. Thus the author believes that self-healing adhesive can be a novel material for future adhesive joints.
Autorenporträt
Nazrul Islam Khan is currently pursuing Ph.D. in Mechanical Engineering Department, NIT Silchar, Assam, India-788010. He has completed B.E. in 2013 from Gauhati University with 1st Class Honours. He has 5 international Journals and 5 Conference Papers in credit.
Herstellerkennzeichnung:
OmniScriptum SRL
Str. Armeneasca 28/1, office 1
2012 Chisinau
MD
E-Mail: info@omniscriptum.com
