Materials for Advanced Packaging

Lieferzeit: Lieferbar innerhalb 14 Tagen

192,59 

ISBN: 0387782184
ISBN 13: 9780387782188
Herausgeber: Daniel Lu/C P Wong
Verlag: Springer Verlag GmbH
Umfang: xii, 724 S., 300 s/w Illustr., 724 p. 300 illus.
Erscheinungsdatum: 10.12.2008
Auflage: 1/2008
Produktform: Gebunden/Hardback
Einband: Gebunden
Artikelnummer: 1746189 Kategorie:

Beschreibung

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

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