Contactless VLSI Measurement and Testing Techniques

Lieferzeit: Lieferbar innerhalb 14 Tagen

106,99 

ISBN: 3319888196
ISBN 13: 9783319888194
Autor: Sayil, Selahattin
Verlag: Springer Verlag GmbH
Umfang: v, 93 S., 23 s/w Illustr., 11 farbige Illustr., 93 p. 34 illus., 11 illus. in color.
Erscheinungsdatum: 04.09.2018
Auflage: 1/2018
Produktform: Kartoniert
Einband: KT

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: – Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as ElectroOptic Probing, Charge Density Probe, and Photoemissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing

Artikelnummer: 6778205 Kategorie:

Beschreibung

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test.

Autorenporträt

Dr. Selahattin Sayil is a Professor in the Philip M. Drayer Department of Electrical Engineering at Lamar University.  His research focuses on VLSI Testing,  Contactless Testing, Radiation effects modeling and hardening at the circuit level, Reliability analysis of low power designs, and Interconnect modeling and noise prediction.

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