Beschreibung
This book highlights a novel and holistic approach to multiscaled PVA bionanocomposite films used for electrical sensing, medical and packaging applications. With a combination of material characterization and modeling to understand the effect of nanoparticle size and shape, as well as 3D interphase properties and features such as interphase modulus and nanoscale dimensions, this book substantiates how excellent mechanical and thermal properties of these materials are achieved. Also it addresses the importance of using economical and ecofriendly bionanocomposites as potential green materials to support the goal of environmental sustainability with multifunctional properties.
Autorenporträt
Mohanad Mousa is currently working at Shatra Technical Institute, Southern Technical University, Iraq after recently graduated with a PhD degree in mechanical engineering from Curtin University, Australia.He was previously an Assistant Lecturer at the Department of Mechanical Engineering, Shatra Technical Institute, Iraq. Mohanad has a wide range of research interests in bionanocomposites, nanomaterials, biopolymers and welding of metals. Dr. Yu Dong is a Senior Lecturer in Mechanical Engineering, School of Civil and Mechanical Engineering at Curtin University, Australia. He has extensive research expertise in polymer nanocomposites, electrospun nanofibers, green composites, micromechanical modeling, nanomanufacturing and design of experiments. He is a Lead Editor for Electrospun Polymers and Composites: Ultrafine Materials, Higher Performance Fibers and Wearables, Elsevier, UK,Manufacturing, Characterisation and Properties of Advanced Nanocomposites, MDPI, Switzerland, and Fillers and Reinforcements for Advanced Nanocomposites, Elsevier, UK, and a Sole Editor for Nanostructures: Properties, Production Methods and Applications, NOVA Science Publishers, USA. Dr. Dong is a Journal Associate Editor for Frontiers in Materials (Polymeric and Composite Materials section) and Applied Nanoscience.
Herstellerkennzeichnung:
Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE
E-Mail: juergen.hartmann@springer.com
