Beschreibung
3D integration has risen a great deal of interest in both the industrial and academic worlds. It is considered a key technology capable of increasing chip performance in the coming years. This book describes the issues introduced by this emerging technology and motivates the need for new design automation tools. It also presents and analyzes extensively the methods developed by the author that address thermal issues in early stages of the design of 3D Multiprocessors Systems-on-Chip (MPSoC).
Autorenporträt
Ignacio Arnaldo received a PhD in Computer Science from the Universidad Complutense in Madrid, Spain in 2013. In 2013, he joined the Anyscale Learning For All (ALFA) group at CSAIL, MIT. His research interests include Machine Learning, Evolutionary Computation, and parallel architectures with special focus on cloud and GPU computing.
