Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

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Springer Theses

ISBN: 9811355851
ISBN 13: 9789811355851
Autor: Cheng, Jie
Verlag: Springer Verlag GmbH
Umfang: xviii, 137 S., 103 s/w Illustr., 137 p. 103 illus.
Erscheinungsdatum: 30.01.2019
Auflage: 1/2018
Produktform: Kartoniert
Einband: KT

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Artikelnummer: 6127272 Kategorie:

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