Subsecond Annealing of Advanced Materials

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Annealing by Lasers, Flash Lamps and Swift Heavy Ions, Springer Series in Materials Science 192

ISBN: 3319352873
ISBN 13: 9783319352879
Herausgeber: Wolfgang Skorupa/Heidemarie Schmidt
Verlag: Springer Verlag GmbH
Umfang: xvii, 321 S., 146 s/w Illustr., 59 farbige Illustr., 321 p. 205 illus., 59 illus. in color.
Erscheinungsdatum: 23.08.2016
Auflage: 1/2014
Produktform: Kartoniert
Einband: Kartoniert

The thermal processing of materials ranges from few femtoseconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.

Artikelnummer: 9701118 Kategorie:

Beschreibung

The thermal processing of materials ranges from few fem to seconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

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