Beschreibung
InhaltsangabeThermodynamics and phase diagrams of lead-free solder materials.- Phase diagrams of Pb-free solders and their related materials systems.- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications.- Rare-earth additions to lead-free electronic solders.- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders.- Sn-Zn low temperature solder.- Composite lead-free electronic solders.- Processing and material issues related to lead-free soldering.- Interfacial reaction issues for lead-free electronic solders.- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.- Deformation behavior of tin and some tin alloys.- Mechanical fatigue of Sn-rich Pb-free solder alloys.- Life expectancies of Pb-free SAC solder interconnects in electronic hardware.- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments.- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.- Electromigration issues in lead-free solder joints.- Stress analysis of spontaneous Sn whisker growth.- Sn-whiskers: truths and myths.- Tin pest issues in lead-free electronic solders.- Issues related to the implementation of Pb-free electronic solders in consumer electronics.- Impact of the ROHS directive on high-performance electronic systems.- Impact of the ROHS Directive on high-performance electronic systems.
Inhaltsverzeichnis
Thermodynamics and Phase Diagrams of Lead-Free Solder Materials.- Phase Diagrams of Pb-Free Solders and their Related Materials Systems.- The Effects of Suppressed Beta Tin Nucleation on the Microstructural Evolution of Lead-Free Solder Joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X Alloys for Pb-free Electronic Solder Applications.- Rare Earth Additions to Lead-Free electronic solders.- Compression Stress-Strain and Creep Properties of the 52In-48Sn and 97In-3Ag Low Temperature Pb-Free Solders.- Sn-Zn Low Temperature Solders.- Composite Lead-Free Electronic Solders.- Processing and Material Processing Issues Related to Lead-free Soldering.- Interfacial Reaction Issues for Lead-Free Electronic Solders.- Deformation Behavior of Tin and some Tin Alloys.- Microstructure-Based Modeling of Deformation in Sn-Rich (Pb-free) Solder Alloys.- Mechanical Fatigue of Sn-rich Pb-free Solder Alloys.- Life Expectancies of Pb-free SAC Solder Interconnects in Electronic Hardware.- Studies dealing with Sn-based solder joint behavior under thermal excursions encountered in service environments.- Electromigration Statistics and Damage Evolution for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages.- Electomigration Issues in Lead-Free Solder Joints.- Stress Analysis of Spontaneous Sn Whisker Growth.- Whisker Growth Issues.- Tin Pest Issues in Lead-Free Electronic Solders.- Issues Related to the Implementation of Pb-free Electronic Solders in Consumer Electronics.- Impact of the ROHS Directive on High Performance Electronic Systems: Part I-Need for Lead Utilization in Exempt Systems, Part II-Key Reliability issues Preventing the Implementation of Lead-Free Solders.