Beschreibung
InhaltsangabePreface; Acknowledgments; Introduction to fine pitch technology (FPT); The family of FPT packages; Fine pitch product applications; Printed circuit boards for fine pitch technology; Solder and application methods; Package placement; Solder reflow; Post reflow cleaning; Inspection, rework, and repair; Design for reliability guidelines; Design for testability; Design for manufacturability; Specific guidelines for FPT packages; Appendices; Glossary; Index
Herstellerkennzeichnung:
Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE
E-Mail: juergen.hartmann@springer.com
