Current Sense Amplifiers

Lieferzeit: Lieferbar innerhalb 14 Tagen

106,99 

for Embedded SRAM in High-Performance System-on-a-Chip Designs, Springer Series in Advanced Microelectronics 12

ISBN: 3642055575
ISBN 13: 9783642055577
Autor: Wicht, Bernhard
Verlag: Springer Verlag GmbH
Umfang: xv, 164 S., 24 s/w Illustr., 164 p. 24 illus.
Erscheinungsdatum: 12.12.2011
Auflage: 1/2011
Produktform: Kartoniert
Einband: Kartoniert
Artikelnummer: 1515514 Kategorie:

Beschreibung

System-on-a-chip (SoC) designs result in a wide range of high-complexity, high-value semiconductor products. As the technology scales towards smaller feature sizes and chips grow larger, a speed limitation arises due to an in­ creased RC delay associated with interconnection wires. Innovative circuit techniques are required to achieve the speed needed for high-performance signal processing. Current sensing is considered as a promising circuit class since it is inherently faster than conventional voltage sense amplifiers. How­ ever, especially in SRAM, current sensing has rarely been used so far. Practi­ cal implementations are challenging because they require sophisticated analog circuit techniques in a digital environment. The objective of this book is to provide a systematic and comprehen­ sive insight into current sensing techniques. Both theoretical and practical aspects are covered. Design guidelines are derived by systematic analysis of different circuit principles. Innovative concepts like compensation of the bit­ line multiplexer and auto-power-down will be explained based on theory and experimental results. The material will be interesting for design engineers in industry as well as researchers who want to learn about and apply current sensing techniques. The focus is on embedded SRAM but the material presented can be adapted to single-chip SRAM and to any other current-providing memory type as well. This includes emerging memory technologies like magnetic RAM (MRAM) and Ovonic Unified Memory (OUM). Moreover, it is also applicable to array­ like structures such as CMOS camera chips and to circuits for signal trans­ mission along highly capacitive busses.

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E-Mail: juergen.hartmann@springer.com

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