Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards

Lieferzeit: Lieferbar innerhalb 14 Tagen

49,80 

Berichte aus der Elektrotechnik

ISBN: 3844064990
ISBN 13: 9783844064995
Autor: Reuschel, Torsten
Verlag: Shaker Verlag GmbH
Umfang: XIV, 187 S., 74 farbige Illustr., 102 Illustr.
Erscheinungsdatum: 21.02.2019
Auflage: 1/2019
Format: 1.4 x 21 x 14.5
Gewicht: 273 g
Produktform: Kartoniert
Einband: Kartoniert
Artikelnummer: 6275445 Kategorie:

Beschreibung

Increasing data rates and reduced design margins oppose a detailed consideration of the diverse aspects of high-speed digital links, such as the passive channel, equalization, and coding. This work offers novel methods for the computationally efficient design and validation of links. A combined system perspective is established based on predominant physical parameters of the interconnect and key parameters of equalizer design. This enables a systematic prediction of design constraints and is accompanied by a study of advanced uncertainty quantification methods for pre- and post-layout design.

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