Thermal Contact Conductance

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109,99 

Mechanical Engineering Series

ISBN: 3319374281
ISBN 13: 9783319374284
Autor: Madhusudana, Chakravarti V
Verlag: Springer Verlag GmbH
Umfang: xviii, 260 S., 116 s/w Illustr., 17 farbige Illustr., 260 p. 133 illus., 17 illus. in color.
Erscheinungsdatum: 23.08.2016
Auflage: 2/2014
Produktform: Kartoniert
Einband: Kartoniert

This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field.

Artikelnummer: 9730816 Kategorie:

Beschreibung

The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.

Autorenporträt

Professor Madhusudana is currently working out of Sudney, Australia

Herstellerkennzeichnung:


Springer Verlag GmbH
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E-Mail: juergen.hartmann@springer.com

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