Laser Processing and Analysis of Materials

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53,49 

ISBN: 1475701950
ISBN 13: 9781475701951
Autor: Duley, Walter W
Verlag: Springer Verlag GmbH
Umfang: xiv, 464 S., 86 s/w Illustr., 464 p. 86 illus.
Erscheinungsdatum: 14.06.2012
Auflage: 1/2012
Produktform: Kartoniert
Einband: Kartoniert
Artikelnummer: 4539801 Kategorie:

Beschreibung

It has often been said that the laser is a solution searching for a problem. The rapid development of laser technology over the past dozen years has led to the availability of reliable, industrially rated laser sources with a wide variety of output characteristics. This, in turn, has resulted in new laser applications as the laser becomes a familiar processing and analytical tool. The field of materials science, in particular, has become a fertile one for new laser applications. Laser annealing, alloying, cladding, and heat treating were all but unknown 10 years ago. Today, each is a separate, dynamic field of research activity with many of the early laboratory experiments resulting in the development of new industrial processing techniques using laser technology. Ten years ago, chemical processing was in its infancy awaiting, primarily, the development of reliable tunable laser sources. Now, with tunability over the entire spectrum from the vacuum ultraviolet to the far infrared, photo chemistry is undergoing revolutionary changes with several proven and many promising commercial laser processing operations as the result. The ability of laser sources to project a probing beam of light into remote or hostile environments has led to the development of a wide variety of new analytical techniques in environmental and laboratory analysis. Many of these are reviewed in this book.

Autorenporträt

Inhaltsangabe1 Lasers and Laser Radiation.- 1.1. Introduction.- 1.2. Laser Sources.- 1.2.1. Ruby Laser.- 1.2.2. Nd-YAG Laser.- 1.2.3. Nd-Glass Laser.- 1.2.4. Tunable Infrared Diode Lasers.- 1.2.5. Helium-Neon Laser.- 1.2.6. Argon and Krypton Ion Lasers.- 1.2.7. Helium-Cadmium Laser.- 1.2.8. CO2 Laser.- 1.2.9. Rare Gas Halide Lasers.- 1.2.10. Dye Lasers.- 1.2.11. Stimulated Raman Scattering.- 1.3. Laser Radiation.- 1.3.1. Monochromaticity.- 1.3.2. Beam Shape.- 1.3.3. Beam Divergence.- 1.3.4. Brightness.- 1.3.5. Focusing of Laser Radiation.- 1.3.6. Coherence.- 1.4. Lens Aberrations.- 1.4.1. Spherical Aberration.- 1.4.2. Coma.- 1.4.3. Astigmatism.- 1.4.4. Field Curvature.- 1.4.5. Distortion.- 1.5. Window Materials.- 1.6. Mirrors and Polarizers.- 1.7. Q-Switching.- 1.7.1. Acousto-Optical Q-Switches.- 1.7.2. Electro-Optical Q-Switches.- 1.7.3. Passive Q-Switching.- 1.8. Frequency Conversion.- 1.9. Mode Locking.- 1.10. Detectors and Power Meters.- 1.10.1. Power Meters.- 1.10.2. Radiation Detectors.- 2. Materials Processing.- 2.1. Absorption of Laser Radiation by Metals.- 2.2. Absorption of Laser Radiation by Semiconductors and Insulators.- 2.3. Thermal Constants.- 2.4. Laser Drilling: Heat Transfer.- 2.4.1. Heating without Change of Phase.- 2.4.2. Heating with Change of Phase.- 2.4.3. Experimental.- 2.5. Welding.- 2.5.1. Heat Transfer-Penetration Welding.- 2.5.2. Heat Transfer-Conduction Welding.- 2.5.3. Welding with Multikilowatt Lasers.- 2.5.4. Welding with Low-Power Lasers.- 2.5.5. Laser Spot Welding.- 2.6. Cutting.- 2.6.1. Heat Transfer.- 2.6.2. Cutting Metals.- 2.6.3. Cutting Nonmetals.- 2.6.4. Scribing and Controlled Fracture.- 2.7. Micromachining.- 2.7.1. Resistor Trimming.- 2.7.2. Machining of Conductor Patterns.- 2.7.3. Fabrication of Gap Capacitors.- 2.7.4. Image Recording.- 2.7.5. Laser Marking.- 2.7.6. Micromachining-Thermal Considerations.- 2.8. Surface Hardening.- 2.9. Surface Melting, Alloying, and Cladding.- 2.10. Surface Cleaning.- 2.11. Crystal Growth.- 2.12. Optical Fiber Splicing.- 2.12.1. Optical Fiber-End Preparation.- 2.12.2. Optical Fiber-Drawing.- 2.13. Laser Deposition of Thin Films.- 2.13.1. Evaporation.- 2.13.2. Electroplating.- 2.13.3. Chemical Vapor Deposition.- 2.13.4. Photodeposition and Photoetching.- 3 Laser Processing of Semiconductors.- 3.1. Introduction.- 3.2. Annealing.- 3.3. Annealing-CW Lasers.- 3.4. Recrystallization.- 3.5. Silicide Formation.- 3.6. Ohmic Contacts and Junction Formation.- 3.7. Device Fabrication.- 3.8. Electrical Connections on Integrated Circuits.- 3.9. Monolithic Displays.- 4 Chemical Processing.- 4.1. Introduction.- 4.2. Schemes for Laser Isotope Separation.- 4.3. The Enrichment Factor.- 4.4. Laser-Induced Reaction.- 4.5. Single-Photon Predissociation.- 4.6. Two-Photon Dissociation.- 4.7. Photoisomerization.- 4.8. Two-Step Photoionization.- 4.9. Photodeflection.- 4.10. Multiphoton Dissociation.- 4.10.1. Deuterium.- 4.10.2. Boron.- 4.10.3. Carbon.- 4.10.4. Silicon.- 4.10.5. Sulfur.- 4.10.6. Chlorine.- 4.10.7. Molybdenum.- 4.10.8. Osmium.- 4.10.9. Uranium.- 4.11. Selective Raman Excitation.- 4.12. Economics of Laser Isotope Separation.- 4.13. Laser-Induced Reactions.- 4.13.1. Infrared Photochemistry-Basic Mechanisms.- 4.13.2. Vibrationally Enhanced Chemical Reactions.- 4.13.3. Vibrationally Induced Decomposition.- 4.14. Isomerization.- 4.15. Lasers in Catalysis.- 4.16. Laser-Induced Reactions: UV-VIS Excitation.- 4.17. Processing via Thermal Heating.- 4.18. Polymerization.- 5 Lasers in Chemical Analysis.- 5.1. Introduction.- 5.2. Absorption Spectroscopy.- 5.2.1. Absorption vs. Other Techniques.- 5.2.2. Intracavity Absorption.- 5.3. Laser-Induced Fluorescence.- 5.3.1. Laser-Induced Fluorescence: Theory.- 5.3.2. Laser-Excited Atomic Flame Fluorescence.- 5.3.3. Laser-Excited Molecular Flame Fluorescence.- 5.3.4. Beam Diagnostics.- 5.3.5. Fluorimetry and Phosphorimetry.- 5.3.6. Selective Excitation of Probe Ion Luminescence.- 5.4. Laser-Enhanced Ionization Spectroscopy.- 5.5. Multiphoton Ion

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