Security and Privacy in Cyber-Physical Systems and Smart Vehicles

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69,54 

First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13,2023, Proceedings, Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering 552

ISBN: 303151629X
ISBN 13: 9783031516290
Herausgeber: Yu Chen/Chung-Wei Lin/Bo Chen et al
Verlag: Springer Verlag GmbH
Umfang: xii, 172 S., 9 s/w Illustr., 48 farbige Illustr., 172 p. 57 illus., 48 illus. in color.
Erscheinungsdatum: 05.02.2024
Auflage: 1/2024
Produktform: Kartoniert
Einband: Kartoniert
Artikelnummer: 1716125 Kategorie:

Beschreibung

This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023. The 11 revised full papers were carefully reviewed and selected from 24 submissions. The papers focus on all details all technological aspects that are relevant to Security and privacy in cyber-physical systems.

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Springer Verlag GmbH
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69121 Heidelberg
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E-Mail: juergen.hartmann@springer.com

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