Produktbild: Snow Mold

Snow Mold

Lieferzeit: Lieferbar innerhalb 14 Tagen

106,99 €

inkl. 7 % MwSt. zzgl. Versandkosten

The Battle Under Snow Between Fungal Pathogens and Their Plant Hosts

ISBN: 9811092435
ISBN 13: 9789811092435
Autor: Matsumoto, Naoyuki/Hsiang, Tom
Verlag: Springer Verlag GmbH
Umfang: x, 136 S., 36 s/w Illustr., 28 farbige Illustr., 136 p. 64 illus., 28 illus. in color.
Erscheinungsdatum: 07.06.2018
Auflage: 1/2018
Produktform: Kartoniert
Einband: Kartoniert

This book provides biological and agricultural insights into snow mold, a fungal disease affecting land plants observed after the melting of snow. Snow mold fungi can cause significant damage to plant growth both in agriculture and in the natural environment, but the interesting ecology and biology described here will capture the attention of scientists in diverse disciplines. The book describes diverse biological phenomena such as cold tolerance of snow mold fungi and plants and their interactions, occurring in an ecologically unique environment under the snow, which maintains constant low temperature and high humidity. Presented here are the unique strategies of snow mold fungi to survive in diverse habitats and the defensive mechanism in plants tolerant to snow mold fungi infection, as well as the conventional control methods using fungicide or cultural practice. Also contained in the book is speculation on the impact of a changing environment on snow mold diseases and their effects on agricultural production.

Artikelnummer: 5450305 Kategorie:

Beschreibung

Autorenporträt

Naoyuki Matsumoto, Ph DFellow, National Agricultural Research OrganizationResearch Fellow, Graduate School of Agriculture, Hokkaido UniversityResearch interests: Ecology of organisms under snow.Tom HsiangProfessor, School of Environmental Sciences, University of Guelph. Research interests: Fungi associated with grasses and trees, and fungal genomics.

Herstellerkennzeichnung:


Springer Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

E-Mail: juergen.hartmann@springer.com

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