Beschreibung
In this work, the focus is on the heat transfer performance of the micro channels with different geometrical configurations. The heat transfer performance is a function of surface area available for the heat transfer and the heat transfer coefficient for the component. In this work, an experimental heat transfer analysis is carried out with copper micro channel heat sinks. Micro channels with four different configurations on the heat sink are fabricated using photo-chemical machining process. The performance analysis is done in the Reynolds Number range of 200 to 1000, with different inlet flow velocities and heat flux values and the experimental analysis emphasis the fact that the geometrical configuration of the channel has a considerable effect on the micro channel heat transfer performance and in turn on the performance of the microelectronic components.
Autorenporträt
I have completed my M. E. (Heat Power) from Savitribai Phule Pune University, Pune, India in 2016 and also I have completed my B. E. (Mechanical) from Solapur university, Solapur, India in 2012. Currently I am working as Assistant Professor in Mechanical Engineering Department.
Herstellerkennzeichnung:
OmniScriptum SRL
Str. Armeneasca 28/1, office 1
2012 Chisinau
MD
E-Mail: info@omniscriptum.com
